LGA 1700 CPU Contact Frame

LGA 1700 Anti-Bending CPU Contact Frame (12th/13th/14th Gen)

This device is an aftermarket CPU contact frame designed specifically for Intel processors using the LGA 1700 socket. This includes Intel’s 12th, 13th, and 14th generation Core CPUs. Its primary function is to replace the motherboard’s standard CPU retention mechanism (ILM).

Key Features and Purpose:

1. Corrects CPU Bending/Warping: The stock LGA 1700 ILM can sometimes exert uneven pressure, potentially causing the CPU’s Integrated Heat Spreader (IHS) to slightly bend over time. This contact frame applies pressure more evenly across the IHS perimeter.
2. Improves Cooler Contact: By maintaining a flatter CPU IHS, the frame ensures better, more uniform contact between the CPU and the base of your CPU cooler (air or liquid).
3. Enhances Thermal Performance: More complete contact leads to better heat transfer away from the CPU. Installing a contact frame often results in lower CPU operating temperatures, although the exact improvement varies depending on the CPU, cooler, and system.
4. Secure Installation: It mounts using the standard motherboard backplate screw points, providing a firm and even hold on the CPU without modifying the socket itself.
5. Material: Typically precision-manufactured (CNC machined) from aluminum alloy for durability and optimal pressure distribution.

In essence, this LGA 1700 contact frame is a popular modification for users of Intel 12th, 13th, and 14th Gen CPUs who want to optimize cooling performance and prevent potential long-term CPU warping caused by the stock mounting system