GENERAL SPECIFICATIONS:Processor Technology for CPU Cores TSMC 4nm FinFET
CPU Compute Die (CCD) Size 178mm²
Package Die Count 1
Unlocked for Overclocking Yes
AMD EXPO™ Memory Overclocking Technology Yes
Precision Boost Overdrive Yes
Curve Optimizer Voltage Offsets Yes
AMD Ryzen™ Master Support Yes
CPU Socket AM5
Supporting Chipsets A620 , X670E , X670 , B650E , B650 , X870E , X870 , B840 , B850
CPU Boost TechnologyPrecision Boost 2
Instruction Setx 86-64
Supported Extensions AES , AMD-V , AVX , AVX2 , AVX512 , FMA3 , MMX-plus , SHA , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , SSE4.2 , SSE4A , x86-64
Max. Operating Temperature (Tjmax)95°C
Launch Date 04/01/2024
*OS SupportWindows 11 – 64-Bit Edition , Windows 10 – 64-Bit Edition , RHEL x86 64-Bit , Ubuntu x86 64-Bit
Connectivity:
Native USB 4 (40Gbps) 2
Native USB 3.2 Gen 2 (10Gbps) 2
Native USB 2.0 (480Mbps) 1
PCI Express® Version PCIe® 4.0
Native PCIe® Lanes (Total/Usable) 20 , 16
NVMe Support Boot , RAID0 , RAID1
System Memory Type DDR5
Memory Channels 2
Max. Memory 256 GB
System Memory Subtype UDIMM
Max Memory Speed :
2x1R DDR5-5200
2x1R DDR5-5200
2x2R DDR5-5200
4x1R DDR5-3600
4x2R DDR5-3600
Graphics Model Discrete Graphics Card Required
AMD Smart Access Memory Available
AI Engine Capabilities:
AMD Ryzen™ AI Available
Performance Up to 16 TOPS
- AMD Enhanced Virus Protection (NX bit) Yes
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