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PAD Thermique ThermalRight EXTREME ODYSSEY 0.5/1.0/1.5 mm

1.800 د.ج2.200 د.ج

Description

Specifications:
Thermal Conductivity(W / m-k):14.8 W/mk
Color:Gray
Density(g/cc):3.1±0.2
Hardness(Sc):30~55
Specifications:85*45 mm
Breakdown Voltage:9.8KV
Electrically Conductive:NO
Harmless:YES
Thermal Pad Thickness:0.5 mm

Specification

Overview

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

Processor

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

Display

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

RAM

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

Storage

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

Video Card

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

Connectivity

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

Features

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

Battery

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

General

Epaisseur

0.5mm

,

1.0mm

,

1.5mm

Description

Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience. This ODYSSEY II THERMAL PAD can withstand electricity up to 9.8 KV, the thermal conductivity is 14.8 W/mk, and it is safe to use with insulation and non-conductivity. This thermal conductive sheet is very versatile and can be tailored for easy use, such as notebook computers, graphics cards, DRAM memory modules, communication equipment, SSD solid-state drives, car control devices, and gaming equipment, etc.

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