| Chipset | INTEL Z890 |
|---|---|
| CPU | Supports Intel® Core™ Ultra Processors (Series 2) LGA 1851 |
| Memory | 4x DDR5 UDIMM, Maximum Memory Capacity 256GB Memory Support 9200 – 6400 (OC) MT/s / 6400 – 4800 (JEDEC) MT/s Max. overclocking frequency: • 1DPC 1R Max speed up to 9200+ MT/s • 1DPC 2R Max speed up to 7200+ MT/s • 2DPC 1R Max speed up to 6400+ MT/s • 2DPC 2R Max speed up to 5600+ MT/s Supports Intel® POR Speed and JEDEC Speed • The DIMM slots on this motherboard only have single-sided latches. |
| Onboard Graphics | 1x HDMI™ Support HDMI™ 2.1, maximum resolution of 4K 60Hz* 1x DisplayPort Support DisplayPort 1.4, maximum resolution of 4K 60Hz* 1x Type-C DisplayPort Thunderbolt™ 4 port, supporting DisplayPort 2.1 with UHBR20 over USB Type-C, with a maximum resolution of 4K@120Hz / 8K@60Hz* *Available only on processors featuring integrated graphics. Graphics specifications may vary depending on the CPU installed. |
| Slot | 3x PCI-E x16 slot 1x PCI-E x1 slot PCI_E1 Gen PCIe 5.0 supports up to x16 (From CPU) PCI_E2 Gen PCIe 4.0 supports up to x1 (From Chipset) PCI_E3 Gen PCIe 4.0 supports up to x4 (From Chipset) PCI_E4 Gen PCIe 4.0 supports up to x4 (From Chipset) |
| Audio | Realtek® ALC897 Codec 7.1-Channel High Definition Audio |
| Storage | 4x M.2 M.2_1 Source (From CPU) supports up to PCIe 5.0 x4 , supports 2280/2260 devices M.2_2 Source (From CPU) supports up to PCIe 4.0 x4 , supports 22110/2280/2260 devices M.2_3 Source (From Chipset) supports up to PCIe 4.0 x4 , supports 2280/2260/2242 devices M.2_4 Source (From Chipset) supports up to PCIe 4.0 x4 / SATA mode, supports 2280/2260/2242 devices 4x SATA 6G *Please refer to the manual for M.2 SSD heatsink restrictions. |
| RAID | Supports RAID 0, RAID 1, RAID 5 and RAID 10 for SATA storage devices Supports RAID 0, RAID 1, RAID 5 and RAID 10 for M.2 NVMe storage devices |
| Onboard Thunderbolt | 1x Thunderbolt4 ports (Rear) Supports up to 40Gbps transfer rate with Thunderbolt devices Supports up to 20Gbps transfer rate with USB4 devices Supports up to 10Gbps transfer rate with USB 3.2 devices Supports up to 5V/3A,15W power charging Each port can daisy-chain up to three Thunderbolt 4 devices or five Thunderbolt 3 devices Supports up to 8K display |
| USB | 4x USB 2.0 (Rear) 4x USB 2.0 (Front) 2x USB 5Gbps Type A (Rear) 4x USB 5Gbps Type A (Front) 1x USB 10Gbps Type A (Rear) 1x USB 10Gbps Type C (Rear) 1x USB 20Gbps Type C (Front) |
| LAN | Realtek® 8126 5Gbps LAN |
| Internal IO | 1x Power Connector(ATX_PWR) 2x Power Connector(CPU_PWR) 1x Power Connector(PCIE_PWR 8pin) 1x CPU Fan 1x Combo Fan (Pump_Sys Fan) 5x System Fan 1x EZ Conn-header (JAF_1) 2x Front Panel (JFP) 1x Chassis Intrusion (JCI) 1x Front Audio (JAUD) 1x Tuning Controller connector(JDASH) 3x Addressable V2 RGB LED connector (JARGB_V2) 1x RGB LED connector(JRGB) 1x TPM pin header(Support TPM 2.0) 4x USB 2.0 ports 4x USB 5Gbps Type A ports 1x USB 20Gbps Type C ports |
| WIRELESS LAN & BLUETOOTH | Intel® Wi-Fi 7 The Wireless module is pre-installed in the M.2 (Key-E) slot Supports MU-MIMO TX/RX, 2.4GHz / 5GHz / 6GHz* (320MHz) up to 5.8Gbps Supports 802.11 a/ b/ g/ n/ ac/ ax/ be Supports Bluetooth® 5.4**, MLO, 4KQAM * 6GHz band support may depend on every country’s regulations and Wi-Fi 7 will be ready in Windows 11 version 24H2. |
| LED FEATURE | 4x EZ Debug LED |
| BACK PANEL PORTS | 
|
| OPERATING SYSTEM | Support for Windows® 11 64-bit |
| BOX CONTENT |  |
| PCB Info | ATX 243.84mmx304.8mm |
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Extended Heatsink
Extended Heatsink enlarges the surface of heat dissipation and maintain the performance at heavy loads.
2-M.2 Shield Frozr
Strengthened M.2 thermal solution helps keep M.2 SSD safe and ensures incredible performance.
3- Heavy Plated VRM Heatsink
The VRM heatsink covers the upper MOS and helps dissipate the heat.
4- 7W/mK Thermal Pad & Additional Choke Pad
High-quality 7W/mK MOSFET thermal pads and additional choke thermal pads ensure stable performance when all cores are runnging at high speed.
5- Enlarged Chipset Heatsink
The enlarged heatsink is designed to reduce dust and noise and capable of maintaining high efficiency of heat dissipation.
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